FOG/FOB Bonding equipment

Key Feature: 1. Double cylinders ofSKING pressure system can eliminate the self-gravity. Minimum pressure accuracy is 0.1kg. 2. Multi-level pulse source design meet the pressure requirement of diversified products. 3. Servo memory function and auto-location function meet the efficiency of alignment, assembly and repair work. 4. Japanese precise SMC pressure components. 5. Interstice vacuum suction of bond head rotary work, save one second suction time and reduce the gas wastage. Basic Parameter 1.Voltage:AC220V 50-60HZ 2.Rating Power:1.5KW (constant heat) 4kw (pulse heat) 3.Operation Mode:7" interface 4. LCD Table:Servo memory and auto-location system 5. Input air presusre:0.4-0.8Mpa 6. Fixture:Micrometer adjust X-Y-θaxis7. Bond Head :60 mm(constant heat) 50mm(pulse heat) 8. Thermocouple:K type 9. Rolling Mode:Auto 10. Program Control: PLC and servo controller 11. Vision System:Two C/L CCD 12. Heat Mode: Constant heator pulse heat 13. Weight: 300kg Dimension:(L)1200 x (W)895 x (H)1440mm Front View and Side View Machine parameter and specification made to customer request