FOG/FOB Bonding equipment

Key Feature: 1. SKING pressure system can eliminate the self-gravity. Minimum pressure accuracy is 0.15kg. 2. Multi-level pulse source design meet the pressure requirement of diversified products. 3. Servo memory function and auto-location function meet the efficiency of alignment, assembly and repair work. 4. Japanese precise SMC pressure components. 5.vacuumabsorbing Basic Parameter 1. Voltage:AC220V 50-60HZ 2. Rating Power:3.5KW 3. Operation Mode:7" interface 4. LCD Table:Servo memory and auto-location system 5. Input Gas:0.4-0.8Mpa 6. Fixture:Micrometer adjust X-Y-θaxis7. Bond Head:100x 2mm(pulse heat) 8. Thermocouple:K type 9. Program Control: PLC and servo controller 10.Alignment System:Two C/L CCD Heat Mode: pulse heat Weight: 400kg Dimension:(L)1900 x (W)1600 x (H)1630mm