COG Bonding machine
original price: 3 000 USD
Jeff Yao
Contact person
Basic Information
Key Feature: Japanese controlling system and precise servo system. Precise linear modules auto-bonding IC and alignment. High clearance CCD alignment vision system, cross mark alignment. Precise micrometer adjustable X-Y-θaxial of fixture. automatic capture the mark and its matching by softwareBasic Parameter Voltage: AC220V 50-60HZ Rating Power:1000W Pressure:0.4-0.8Mpa Operation Mode: 7" interface Work Mode: automatic Alignment System: Cross mark position Aligning Accuracy: ±5um Bond Head: L:30mm W:4mm (Customization) Ambient Treatment: FFU high efficient filtration(optional) Fixture: Micrometer adjust X-Y-θaxis Weight:450kg Dimension:(L)880 x (W)970x (H)1380mm Machine parameter and specification made to customer request
Delivery terms and packaging
Packaging Detail: woodencase Delivery Detail: 45 days
Port: shenzhen or hongkong
Payment term
Telegraphic transfer
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Payment Methods
We accept:
